Mold-Tech Singapore Pte Ltd
- Lei
- 5493002Q8YOZ2CYWHY96
- Legal Form
- PRIVATE LIMITED
- Registered Address
- KA Place, 159, Kampong Ampat,#01-01, #01-01, Singapore 368328, Singapore
- Headquarter Address
- KA Place, 159, Kampong Ampat,#01-01, #01-01, Singapore 368328
- Legal Jurisdiction
- SG
- Inferred Jurisdiction
- Singapore
- Business Registry Name
- RA000523
- Business Registry Identifier
- 199304132N
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Legal Entity Identifier (LEI) details
- Registered By
- 52990034RLKT0WSOAM90
- Assignment Date
- 2017-03-18 01:51:00 UTC
- Record Last Update
- 2023-08-05 07:32:44 UTC
- Next Renewal Date
- 2018-03-16 17:56:00 UTC
- Status Code
- LAPSED
Imported from gleif on
May 13 2025, 8.23AM