BOCHK All Weather Asian High Yield Bond Fund
- Lei
- 2549006PS4HO89LDM372
- Legal Form
- Sub-Fund
- Registered Address
- Suite 1507, 15/F 1111 King's Road, Hong Kong 999077, Hong Kong
- Headquarter Address
- c/o BOCHK Asset Management Limited, 5/F, Bank of China Building, Hong Kong 999077
- Legal Jurisdiction
- HK
- Inferred Jurisdiction
- Hong Kong
- Business Registry Name
- RA000390
- Business Registry Identifier
- BPG265
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BOCHK All Weather Asian High Yield Bond Fund
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Legal Entity Identifier (LEI) details
- Registered By
- 5493001KJTIIGC8Y1R12
- Assignment Date
- 2020-05-22 14:46:11 UTC
- Record Last Update
- 2024-05-23 11:25:40 UTC
- Next Renewal Date
- 2025-05-23 11:25:40 UTC
- Status Code
- ISSUED
Imported from gleif on
June 26 2024, 12.22PM