CSOP Enhanced Bond Fund
- Lei
- 254900BNPGP66YZV9H47
- Legal Form
- SUB-FUND
- Registered Address
- 2801-2803 & 3303-3304, Two Exchange Square, Hong Kong 999077, Hong Kong
- Headquarter Address
- C/O CSOP Asset Management Limited, Suite 2801-2803, Two Exchange Square, Hong Kong 999077
- Legal Jurisdiction
- HK
- Inferred Jurisdiction
- Hong Kong
- Business Registry Name
- RA000390
- Business Registry Identifier
- BUV354
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CSOP Enhanced Bond Fund
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Legal Entity Identifier (LEI) details
- Registered By
- 5493001KJTIIGC8Y1R12
- Assignment Date
- 2024-05-24 08:59:36 UTC
- Record Last Update
- 2025-04-28 21:11:08 UTC
- Next Renewal Date
- 2026-05-24 08:59:36 UTC
- Status Code
- ISSUED
Imported from gleif on
May 10 2025, 1.55PM