頎邦科技股份有限公司
- Lei
- 254900AK7VTHB4UYLR40
- Legal Form
- 企業
- Registered Address
- 科學工業園區力行五路三號, 新竹市 30078, Taiwan, Province of China
- Headquarter Address
- 科學工業園區力行五路三號, 新竹市 30078
- Legal Jurisdiction
- TW
- Inferred Jurisdiction
- Taiwan, Province of China
- Transliterated Registered Name
- Qi Bang Ke Ji Gu Fen You Xian Gong Si
- Other Names
- CHIPBOND TECHNOLOGY CORPORATION (Alternative Language Legal Name, En)
- Business Registry Name
- RA000551
- Business Registry Identifier
- 16130009
Legal Entity Identifier (LEI) details
- Registered By
- 655600IJ8LS3CCDA4421
- Assignment Date
- 2018-01-05 17:47:40 UTC
- Record Last Update
- 2022-03-01 06:34:06 UTC
- Next Renewal Date
- 2021-01-05 17:47:40 UTC
- Status Code
- LAPSED
Imported from gleif on
May 1 2024, 8.30PM