SJPISG GLOBAL HIGH YIELD BOND USD HGD
- Lei
- 213800WWP2Y62IB4N107
- Legal Form
- FUND
- Registered Address
- 1 RAFFLES PLACE, #15-61, ONE RAFFLES PLACE, SINGAPORE, SG-04 048616, Singapore
- Headquarter Address
- C/O ST. JAMES’S PLACE INTERNATIONAL PLC (SINGAPORE BRANCH), 1 RAFFLES PLACE, #15-61 ONE RAFFLES PLACE TOWER 2, SINGAPORE, SG-04 048616
- Legal Jurisdiction
- SG
- Inferred Jurisdiction
- Singapore
- Other Names
- SJPISG INTERNATIONAL CORPORATE BOND HEDGED USD (Previous Legal Name, En)
- Business Registry Name
- RA999999
- Business Registry Identifier
- T14FC0072F
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Legal Entity Identifier (LEI) details
- Registered By
- London Stock Exchange LEI Limited
- Assignment Date
- 2016-10-04 00:00:00 UTC
- Record Last Update
- 2024-08-29 10:51:28 UTC
- Next Renewal Date
- 2025-10-28 00:00:00 UTC
- Status Code
- ISSUED
Imported from gleif on
November 22 2024, 4.01AM