SJPISG CORPORATE BOND SGD HGD
- Lei
- 213800OEVW23U8YZCX59
- Legal Form
- FUND
- Registered Address
- C/O ST. JAMES'S PLACE INTERNATIONAL PLC (SINGAPORE BRANCH), 1 RAFFLES PLACE, #15-61 ONE RAFFLES PLACE, TOWER 2 SINGAPORE, SINGAPORE, SG-01 048616, Singapore
- Headquarter Address
- C/O ST. JAMES'S PLACE INTERNATIONAL PLC, FLEMING COURT, FLEMINGS PLACE, DUBLIN, IE-D D04 N4X9
- Legal Jurisdiction
- SG
- Inferred Jurisdiction
- Singapore
- Business Registry Name
- RA999999
- Business Registry Identifier
- Not supplied!
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SJPISG CORPORATE BOND SGD HGD
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Legal Entity Identifier (LEI) details
- Registered By
- London Stock Exchange LEI Limited
- Assignment Date
- 2023-06-08 00:00:00 UTC
- Record Last Update
- 2024-04-09 13:10:17 UTC
- Next Renewal Date
- 2025-06-08 00:00:00 UTC
- Status Code
- ISSUED
Imported from gleif on
December 22 2024, 3.21AM