HSBC ASIAN HIGH YIELD BOND FUND
- Lei
- 2138008VYWWAWZ695W52
- Legal Form
- SUB-FUND
- Registered Address
- C/O HSBC INVESTMENT FUNDS (HONG KONG) LIMITED, HSBC MAIN BUILDING, 1 QUEEN’S ROAD, CENTRAL ., Hong Kong
- Headquarter Address
- C/O HSBC INVESTMENT FUNDS (HONG KONG) LIMITED, HSBC MAIN BUILDING, 1 QUEEN’S ROAD, CENTRAL, GB-LND E14 5HQ
- Legal Jurisdiction
- HK
- Inferred Jurisdiction
- Hong Kong
- Business Registry Name
- RA000390
- Business Registry Identifier
- AWW747
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HSBC ASIAN HIGH YIELD BOND FUND
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Legal Entity Identifier (LEI) details
- Registered By
- London Stock Exchange LEI Limited
- Assignment Date
- 2014-09-30 00:00:00 UTC
- Record Last Update
- 2023-08-01 09:21:00 UTC
- Next Renewal Date
- 2024-09-30 00:00:00 UTC
- Status Code
- ISSUED
Imported from gleif on
May 10 2024, 3.35AM