HSBC ASIA HIGH INCOME BOND FUND
- Lei
- 2138008DFKJFMPCBUE43
- Legal Form
- SUB-FUND
- Registered Address
- C/O HSBC INVESTMENT FUNDS (HONG KONG) LIMITED, HSBC MAIN BUILDING, 1 QUEEN’S ROAD, CENTRAL E14 5HQ, Hong Kong
- Headquarter Address
- C/O HSBC INVESTMENT FUNDS (HONG KONG) LIMITED, HSBC MAIN BUILDING, 1 QUEEN’S ROAD, CENTRAL E14 5HQ
- Legal Jurisdiction
- HK
- Inferred Jurisdiction
- Hong Kong
- Business Registry Name
- RA000390
- Business Registry Identifier
- BIM280
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HSBC ASIA HIGH INCOME BOND FUND
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Legal Entity Identifier (LEI) details
- Registered By
- London Stock Exchange LEI Limited
- Assignment Date
- 2016-12-06 00:00:00 UTC
- Record Last Update
- 2023-11-27 14:41:32 UTC
- Next Renewal Date
- 2024-12-16 00:00:00 UTC
- Status Code
- ISSUED
Imported from gleif on
March 29 2024, 4.08AM